Cuts and punches encapsulant film and lays it over the cells. Dual-roll feeding, hot-melt splicing, alignment and servo tension control support precise placement; an integrated punching die and glass alignment enable changeover.
Specifications
| Compatible module size | L: 1650–2550 mm; W: 990–1450 mm |
| Cycle time | ≤ 14 s |
| Power supply | AC 380 V, 3P5W, 50/60 Hz |
| Power | 7 kW |
| Compressed air | 0.6–0.8 MPa; air consumption: 0.3 m³/min |
| Noise level | ≤ 80 dB |
| Weight | 3500 kg |
| Overall dimensions | 6300 × 3000 × 1900 mm |
| Options | standard*/single-spindle |