Uses heat and pressure under vacuum to melt and cure encapsulant, bonding glass, cell strings and backsheet into a module. Single-, double- and triple-layer configurations, chamber counts and heating methods can be customized. Easy operation, uniform temperature control and stable performance; designed for energy efficiency and high product yield.
Specifications
| Machine model | 2700 × 8700 mm |
| OL | |
| Heating method | oil heating |
| Operating temperature | room temperature (RT) to 180 °C |
| Temperature uniformity | ±1.5 °C |
| Temperature accuracy | ±1 °C |
| Conveying accuracy | ±3 mm |
| Noise level | ≤ 80 dB |
| Yield | 99.99 % |